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The Pansonic arc welding robot cell PERFORMARC ET (Electrical Turntable) is a modular concept, developed using standard reliable Panasonic components.

The Pansonic arc welding robot cell PERFORMARC ET (Electrical Turntable) is a modular concept, developed using standard reliable Panasonic components.

The Pansonic arc welding robot cell PERFORMARC ET (Electrical Turntable) is a modular concept, developed using standard reliable Panasonic components.

PGMA - Panasonic Guided Manual Assembly helps to enhance manual assembly.

he system design allows for the coverage of a wide range of different sized work components by utilizing twin workstation manipulation. The cell comprises of the latest technically advanced Panasonic robot and welding components seamlessly integration into a system configuration for simple user-friendly control. The torsion-free base frame design ensures accurate position location of the robot and work piece manipulation providing the capability to pick up and move the total system without any need of programming correction.

The system design allows for the coverage of a wide range of different sized work components by utilizing twin workstation manipulation. The cell comprises of the latest technically advanced Panasonic robot and welding components seamlessly integration into a system configuration for simple user-friendly control. The torsion-free base frame design ensures accurate position location of the robot and work piece manipulation providing the capability to pick up and move the total system without any need of programming correction.

Featuressmart-factory-solutions software panacim-logo-02In order to make electronics manufacturing more efficient, digital planning tools and reliable data management are becoming increasingly important. This applies not only to individual systems, but to entire production lines, in which the data of each individual machine is included in the analysis. To achieve this, Panasonic developed the line management system PanaCIM-EE. With PanaCIM-EE, higher production rates and reduced cycle times can be achieved to make electronics production even more efficient and reliable. The PanaCIM-EE provides an integrated management of an entire SMT floor and achieves enhanced quality, reduced costs and increased floor productivity. This includes 8 functions, like traceability, production analysis plus monitoring and dispatching, material control and verification, maintenance management and the handling of production changeovers, linked to the customer system.

Application examplessmart-factory-solutions software_panacim application-01PREDICTIVE MANAGEMENT OF PARTS EXHAUST AND AUTOMATIC PARTS OUTPUT(Material Verification + Material Control) No waiting for parts to be supplied due to“No Parts"! Realize Reduce labor resources and Productivity improvement ! smart-factory-solutions software panacim application-02COMPONENT SUPPLY NAVIGATOR(Production Monitoring and Dispatch / Component Supply Navigator option) Reduction of the duration of machine downtime caused by parts exhaust by 73.1%*As a result of (1), the operating ratio increased by 10%**May vary depending on your operating environment. System configuration examplessmart-factory-solutions software panacim system-configuration-01CM SERIES LINEPanaCIM-EE server (app server + controller server)PanaCIM maintenance serverPT interface (communication with PT200)*System configuration differs depending on applied machine. For details, contact your local distributor or sales representative.

Building upon the PSX307 Plasma Cleaner, the PSX307A Plasma Cleaner features an enlarged plasma chamber capacity that improves productivity. In addition, the PSX307A system is able to handle full wafers (both bare and on dicing frames).  Besides the increased capacity, Panasonic's original Plasma Monitoring System suppresses abnormal discharges resulting in a secure and efficient production process.  Additionally, the option to include a traceability functionality  ensures high level process Quality.

The PSX307 Plasma Cleaner provides 1.5 times the productivity of conventional plasma cleaners. Panasonic's parallel plate plasma chamber technology delivers superior etch uniformity compared to conventional batch-type plasma cleaner systems.By using an argon plasma treatment, ultra-thin gold-plated electrodes can be wire-bonded reliably without the formation of nickel compounds. The savings achieved in cheaper gold plating can provide the ROI justification alone. The PSX307 Plasma Cleaner's other capabilities include surface modification by oxygen plasma, improving mold resin adhesion and under-fill wettability, and reducing the incidence of peel-off, voids, and cracks.Panasonic's Plasma Monitoring System suppresses abnormal discharges for a secure and efficient production process. The option to include traceability functionality ensures high level process quality as well.

The MD-P300 Flip-chip Bonder is process-flexible, combining flip-chip and thermosonic bonding in a single, small-footprint solution.The MD-P300 contributes to the cost-effective production (high yield, high throughput) of value-added devices. The MD-P300 can achieve high speed and high accuracy bonding through its low gravity point and lightweight bonding head. The MD-P300 supports 300 mm (12") wafers, and is an ideal solution for COB hybrid assembly in combination with an in-line Panasonic SMT placement machine.The MD-P300 is capable of fast cycle times and a placement accuracy of +/-5 μm at 0.5 seconds per IC (dry run) - with thermosonic processes at 0.65 seconds, including process times.

Unit Level Manufacturing by the synchro-motion of dispensing and bondingThe MD-P200's die bonding is carried out immediately after epoxy dispensing, thereby making it possible to finish the bonding operation before the epoxy has deteriorated. This realizes stable and high quality bonding at all bond positions on a substrate. In addition, the bonding stage camera enables pre-bonding inspection immediately after epoxy dispensing and post-bonding control immediately after the bonding of a die. This process enables manufacturing with real-time quality inspection.User-friendly operationA large touch panel and interactive software realize an easy and reliable operating environment for all users from beginners to experts.

Plasma dicing is becoming increasingly attractive in the semiconductor market. Dies are becoming smaller and thinner and manufacturers are facing difficulties such as increasing material loss due to the width of the dicing line, mechanical damage to the dies from chipping and increasingly longer processing times due to line-by-line mechanical dicing. Panasonic’s APX300 Plasma Dicer solves these challenges and simultaneously provides a higher quality product with a lower cost of production. Features and benefits of Panasonic's APX300 Plasma DicerPlasma dicing requires a dicing street mask. After the mask is applied to the surface of the wafer and the dicing streets are exposed, the plasma process etches the exposed streets by a chemical reaction. By using a chemical etching process, a chipping-free and particle-free process is achieved. Thanks to the use of mask patterning, narrower street widths are possible – allowing more chips to be designed onto the wafer. Furthermore, the mask patterning allows complete flexibility in chip size, shape and position. The benefits of the Panasonic APX300 Plasma Dicer are: Particle-free and damage-free processHigher chip strengthYield improvementsThe Panasonic APX300 is available in a stand-alone single chamber (1 chamber) or a multi chamber (1, 2, or 3 chambers) configuration.  Panasonic can provide a plasma dicing total solution to achieve a damage-free, particle-free, higher throughput and lower overall cost of production. The Panasonic APX300 is CE certified.